The services available include mechanical tests such as shearing and traction tests and roughness and hardness measurements. Thermoanalysis tests such as dynamic mechanical-thermal analysis (DMTA) or dynamic difference calorimetry (DSC) are available for characterising the thermal behaviour of materials. As well as visual processes such as the examination of metallography samples under the light or electron microscope, analytical surface evaluations using energy-dispersive X-ray spectroscopy (REM-EDX) or X-ray fluorescence analysis (RFA) are also available. This enables both the structure and the chemical composition of the materials to be examined. Finally, it is possible to simulate environmental conditions by means of various climatic and temperature shock cabinets.

In the event that the application requires a non-destructive test of the component, this can be achieved using X-ray computer tomography. The 3D image of the scanned component contains all the details. This makes it possible to check the internal structures for clearance and dimensional accuracy. Defects such as pores and cracks can be found and their size and positioning can be documented with a level of accuracy measured in micrometres. The precise analysis of the variations in the tomographed component of the CAD model will enable the production tools to be improved on a targeted basis.

Another key area is the examination and optimisation of production processes and materials for electronic modules. Appropriate equipment is available for this purpose, such as assembly equipment, stencil printers, dispensers, wave and reflow solder machines, as well as a wire bonding station.

 

Fig. 1:  X-ray computer tomography of a D-Sub connector The plastic portion (small photo) has been blanked out.

 

Fig. 2: X-ray computer tomography of a bicycle valve Left: 3D image, right: 2D section.

 

 

Fig. 3: Metallographic damage analysis on electronic assemblies Left: Electron microscope image of cracks in an SMD ceramic capacitor, right: Gas inclusion in a soldering point of an electronic component

 

 

 

ZeWiS-Zentrum für wissenschaftliche Services
Glanzstoffstraße 1, Geb. Wa 07
63784 Obernburg